Esec

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flip chip, packaging, led, plating, epoxy, solar, die bonder, die sorter, wire bonder, mikroelektronik, leybold, substrates, rf devices, advanced packaging equipment, ball bumping, bonding equipment, olp, zug, die attach, chipscale, maschinen hersteller, 300mm, mems, bonding gold wire ball, thin die, stacked die, smart card, semiconductor packaging equipment, flipchip, oerlikon, eutectic, space, ultra fine pitch, datastorage, precision technology, backend, qfn, mcm, werkzeuge hersteller, saurer, vacuum, back end, bond, glue attach, copper, microelectronics, loc, high tech, mcm packaging equipment, softsolder, transmissions, optoelectronics assembly equipment, textile, semiconductors, micron, coating, wedges, halbleiterindustrie, adhesive bonding, pfäffikon, backend assembly equipment, boc, tape attach, optics, ssd, wafer, chip, bonder ball wire wedge, bga, offline programming, drahtbonder, bonding tools, graziano, fairfield, esen, sbga, balzers, unaxis, automotive, drive systems

Dienstleistung Kategorien

flip chip  packaging  led  plating  epoxy  solar  die bonder  die sorter  wire bonder  mikroelektronik  leybold  substrates  rf devices  advanced packaging equipment  ball bumping  bonding equipment  olp  zug  die attach  chipscale  maschinen hersteller  300mm  mems  bonding gold wire ball  thin die  stacked die  smart card  semiconductor packaging equipment  flipchip  oerlikon  eutectic  space  ultra fine pitch  datastorage  precision technology  backend  qfn  mcm  werkzeuge hersteller  saurer  vacuum  back end  bond  glue attach  copper  microelectronics  loc  high tech  mcm packaging equipment  softsolder  transmissions  optoelectronics assembly equipment  textile  semiconductors  micron  coating  wedges  halbleiterindustrie  adhesive bonding  pfäffikon  backend assembly equipment  boc  tape attach  optics  ssd  wafer  chip  bonder ball wire wedge  bga  offline programming  drahtbonder  bonding tools  graziano  fairfield  esen  sbga  balzers  unaxis  automotive  drive systems  

Bezogene Services

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Datacon introduces new machine Datacon Esec Fico Meco

Welcome to the world of Besi

BE Semiconductor Industries N.V. and its subsidiaries Datacon, Esec, Fico and Meco, is a leading manufacturer of semiconductor die sorting, flip chip and multi-chip die bonding, wire bonding, packaging and plating equipment, for both array connect and leadframe assembly processes.

31 May 2012 Dividend: Delivery of shares ("stock dividend"). [read more] 21 Jun 2012 SNS Securities Small & Midcap Seminar [read more]

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Esec 2009 fS E - NEW! More information

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