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8303 Bassersdorf Grindelstrasse 40
Dyconex Ag Karte
Dyconex Ag
Webseite (dyconex.com)
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DYCONEX is a leading manufacturer of high-end, high-reliability printed circuit boards (PCB's) and multi-chip-modules (MCM's) with a strong focus on high-density interconnect/microvia applications.
Dienstleistung Kategorien
aerospace automotive avionics system biomedical capabilities defense system defibrillators dyconex dyconex ag dyconex ag bassersdorf high-end high-end flex high-frequency high-reliability implantable medical devices multi-chip-modules pacemakers rigid circuit rigid-flex scientific technologie technology telecommunicationsBezogene Services
Anzeige:Supported by over 40 years of leading-edge interconnect experience, DYCONEX specializes in high-end, high-reliability PCB solutions for sophisticated medical devices, aerospace systems as well as for semiconductor packaging and industrial applications.
DYCONEX is an integral part of the MST Group, which currently comprises five technology companies located in Europe and the US. This globally active group provides innovative products and services for medical devices including implants and other high-performance industries.
We have a proven track record in producing IPC Class 3 PCBs for medical and other critical applications. Your most demanding requirements are with us in the best of hands. To achieve optimal results, we support you from design, through prototyping all the way to volume production.
14.05.2012 DYCONEX demonstrates 20-μm line & space capability on multilayer LCP product
DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!
more information
14.05.2012 DYCONEX is rated as a No.1 company by Dun & Bradstreet
Dun & Bradstreet is one of the world's most respected sources of business information, enabling companies to make commercial decisions with a high level of confidence. We are pleased to announce that in March 2012, DYCONEX AG was awarded a No.1 rating by Dun & Bradstreet for our financial strength, creditworthiness and minimum risk of failure.
more information
05.04.2012 DYCONEX is a founding member of iNEMI’s «Defining Reliability Requirements for Implantable Medical Devices» project
We are proud to announce that DYCONEX is a founding member of a project being set up by the International Electronics Manufacturing Initiative (iNEMI) entitled «Defining Reliability Requirements for Implantable Medical Devices.»
more information
FPC for medical implants Miniaturization-driven PCBs used in implantable medical devices, hearing aids and other medical applications require ever finer structures on multilayer flex circuits. Increasingly high levels of chip integration, smaller component footprints and reduced device form factors are driving requirements towards ultra HDI properties. Among these are sub 50/50 micron lines and spaces with via/pad geometries below 50/150 microns - and all this is achieved by applying DYCOstrate technology.
DYCONEX is an integral part of the MST Group, which currently comprises five technology companies located in Europe and the US. This globally active group provides innovative products and services for medical devices including implants and other high-performance industries.
We have a proven track record in producing IPC Class 3 PCBs for medical and other critical applications. Your most demanding requirements are with us in the best of hands. To achieve optimal results, we support you from design, through prototyping all the way to volume production.
14.05.2012 DYCONEX demonstrates 20-μm line & space capability on multilayer LCP product
DYCONEX has reached yet another significant milestone in its quest to bring cutting-edge technology to the marketplace: ultra-high density LCP substrates!
more information
14.05.2012 DYCONEX is rated as a No.1 company by Dun & Bradstreet
Dun & Bradstreet is one of the world's most respected sources of business information, enabling companies to make commercial decisions with a high level of confidence. We are pleased to announce that in March 2012, DYCONEX AG was awarded a No.1 rating by Dun & Bradstreet for our financial strength, creditworthiness and minimum risk of failure.
more information
05.04.2012 DYCONEX is a founding member of iNEMI’s «Defining Reliability Requirements for Implantable Medical Devices» project
We are proud to announce that DYCONEX is a founding member of a project being set up by the International Electronics Manufacturing Initiative (iNEMI) entitled «Defining Reliability Requirements for Implantable Medical Devices.»
more information
FPC for medical implants Miniaturization-driven PCBs used in implantable medical devices, hearing aids and other medical applications require ever finer structures on multilayer flex circuits. Increasingly high levels of chip integration, smaller component footprints and reduced device form factors are driving requirements towards ultra HDI properties. Among these are sub 50/50 micron lines and spaces with via/pad geometries below 50/150 microns - and all this is achieved by applying DYCOstrate technology.
Rigid-flex PCB for 3D miniaturization In order to reduce the overall packaging form factor for a "smart pill" application, folded high-density (HDI) rigid-flex technology was employed. Thanks to this innovative approach, all mounting and assembly requirements were achieved together with optimal volume utilization.
High performance rigid PCB Having a strong aerospace and defense background, DYCONEX has as one of its core specialties ruggedized high-density multilayer PCBs. Our dedicated engineering team concentrates primarily on highly complex rigid interconnect solutions such as the one shown here from a Formula 1 steering wheel dashboard.
Advanced packaging substrates DYCOstrate technology represents the ideal solutions for prototypes and small to medium batches of advanced packaging interconnect, here incorporated in a SiP (system in package) substrate for a GPS module. Various organic substrate types are available for packages such as BGA (ball grid array, both singulated and map), CSP (chip scale package) and MCM (multichip module).
High performance rigid PCB Having a strong aerospace and defense background, DYCONEX has as one of its core specialties ruggedized high-density multilayer PCBs. Our dedicated engineering team concentrates primarily on highly complex rigid interconnect solutions such as the one shown here from a Formula 1 steering wheel dashboard.
Advanced packaging substrates DYCOstrate technology represents the ideal solutions for prototypes and small to medium batches of advanced packaging interconnect, here incorporated in a SiP (system in package) substrate for a GPS module. Various organic substrate types are available for packages such as BGA (ball grid array, both singulated and map), CSP (chip scale package) and MCM (multichip module).
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